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Reducing the amount of chemical substances used and their emissions by introducing a multi-spot flow system

  • Environment
  • Ecosystems
  • Activities at sites

P.T. TEC Indonesia

As part of our measures to reduce environmental impacts, we appropriately manage chemical substances and continue to make efforts to reduce their use and emissions in manufacturing processes. In the regular circuit board manufacturing process, isopropyl alcohol (IPA) is used in the pre-treatment for soldering to clean the entire circuit board surface. However, in an attempt to reduce environmental impacts, since some circuit boards can be cleaned with partial coating, we have adopted a soldering system called "multi-spot flow" that reduces the amount of IPA used and its emissions when performing partial coating.
This system has already been installed at our manufacturing sites in China and other countries and we have achieved some results. In FY2019, P.T. TEC Indonesia introduced this system and reduced the amount of IPA used in the circuit board manufacturing process by 25%. Partially implementing this system also reduces the energy used to melt solder, thus contributing to global warming countermeasures.