Research News
04 Jun, 2025
TOKYO---Toshiba Corporation has developed a resin-insulated SiC power semiconductor module (SiC power module) that greatly improves power density, which represents the capacity to process power per unit area, by using resin as the insulating substrate through technology for the distributed layout design of small-area chips and design optimization technology using AI, which are unique to Toshiba.
26 Feb, 2025
TOKYO—Toshiba Corporation (Toshiba) and Toshiba Information Systems (Japan) Corporation (Toshiba Information Systems) have developed an innovative optical inspection technology that can instantly, from a single image, visualize nano-scale*1 height differences in surface defects, such as scratches, as 3D shapes on product surfaces.