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Toshiba Corporate Manufacturing Engineering Center

Core Manufacturing Technology

Electronic device packaging technology

To achieve the desired performance of Toshiba Group products at a reasonable cost, we are developing circuit board assembly technology that directly facilitates product development, combining various technologies and developments such as CAD/CAE simulation technology, advanced electronic component evaluation technology, development of printed wiring boards, advanced mounting processes technology, and physicochemical analysis technology.

Developing tools for product development

We develop our own tools for efficient product development and work to advance overall product design technology and reliability of evaluation technology through the linking of circuit board units with electromechanical technologies.

Review tool for visualizing setting data (Toshiba)

Collaborative design check through linking of electrical and mechanical technology (Toshiba)

Circuit board life prediction technology (CAE and Toshiba tool)

Surface-mount processes technology

Drawing on our evaluation technology for next-generation semiconductor packages and small parts with a narrow lead pitch, we are developing electronic components in addition to assembly materials (such as solder paste and adhesion reinforcing members) and cutting-edge surface-mount processes.

[Image] Development of SMT mounting technologies

[Image] Development of component technologies

[1]SMT：Surface Mount Technology

Mounted circuit board evaluation technology

To guarantee reliability and achieve high performance and multifunctionality of electronic devices, we are developing printed wiring boards and electronic components through various evaluation technologies, the improvement of reliability evaluation, and the improvement of precision in quality control through physicochemical analysis.