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Toshiba Corporate Manufacturing Engineering Center

Core Manufacturing Technology

Electronics parts assembly technology

We engage in the performance enhancement and the cost saving of the product and the system, development of the production engineering of the new product for main force business of Toshiba such as a electronic device, social infrastructure and the energy based on a technique about Si processing, the joining and the adhesion.

Design, simulation, and evaluation technologies

To improve the efficiency of production technology development, we are developing simulation technology for bonding processes and technology for analyzing the performance of assembled products.

Failure case of solder joint

Analysis technologies to predict failures in the design phase

Bonding and assembly technologies

We are developing cutting-edge joining and assembly technology as well as advanced production technology using IoT, while endeavoring to customize and deploy them for applicable products.

Innovative manufacturing process technologies

We are engaged in research on innovative process technologies in order to further improve product performance and productivity and reduce costs.

Metal-assisted chemical etching

Plasma-activated bonding