Toshiba Corporate Manufacturing Engineering Center
Core Manufacturing Technology
Electronics parts assembly technology
We engage in the performance enhancement and the cost saving of the product and the system, development of the production engineering of the new product for main force business of Toshiba such as a electronic device, social infrastructure and the energy based on a technique about Si processing, the joining and the adhesion.
![[Image] Electronics parts assembly technology](/content/dam/toshiba/migration/corp/manufacturingAssets/cmc/rd/core/img/focus/top.jpg)
Design, simulation, and evaluation technologies
To improve the efficiency of production technology development, we are developing simulation technology for bonding processes and technology for analyzing the performance of assembled products.
![[Image] Failure case of solder joint](/content/dam/toshiba/ww/technology/corporate/cmc/rd/core/core_focus/01_01.png)
Failure case of solder joint
![[Image] Analysis technologies to predict failures in the design phase](/content/dam/toshiba/ww/technology/corporate/cmc/rd/core/core_focus/01_02.png)
Analysis technologies to predict failures in the design phase
Bonding and assembly technologies
We are developing cutting-edge joining and assembly technology as well as advanced production technology using IoT, while endeavoring to customize and deploy them for applicable products.
![[Image] Bonding and assembly technologies](/content/dam/toshiba/ww/technology/corporate/cmc/rd/core/core_focus/02_01.png)
Innovative manufacturing process technologies
We are engaged in research on innovative process technologies in order to further improve product performance and productivity and reduce costs.
![[Image] Metal-assisted chemical etching](/content/dam/toshiba/ww/technology/corporate/cmc/rd/core/core_focus/03_01.png)
Metal-assisted chemical etching
![[Image] Plasma-activated bonding](/content/dam/toshiba/ww/technology/corporate/cmc/rd/core/core_focus/03_02.png)
Plasma-activated bonding