Toshiba Corporate Manufacturing Engineering Center

Core Manufactuing Technology

Electronic packaging and assembly technology

We are working on innovations in microelectronics package design using CAD/CAE and advanced process and reliability evaluation technologies that meet the needs for high-performance and low-cost electronics.

[Image] Electronic packaging and assembly technology

Design and reliability evaluaton technology

We are developing thermal and structural designs using simulation technologies, as well as reliability evaluation technologies for compact, high-performance, multifunctional electronics.

[Image] Thermal resistance measurement and simulation of semiconductor package

Thermal resistance measurement and simulation of semiconductor package

[Image] Solder joint after reliability test

Solder joint after reliability test

[Image] Stress analysis of package

Stress analysis of package

[Image] Reliability evaluation of solder joint

Reliability evaluation of solder joint

Microelectronics package and module technology

Our efforts are also focused on the development of microelectronics packaging processes for advanced LSIs, high-frequency devices, power devices, optical devices, and MEMS devices.

[Image] Metal embedding into micro via hole

Metal embedding into micro via hole

[Image] In-line wafer-level package for MEMS

In-line wafer-level package for MEMS

[Image] Power module assembly

Power module assembly

Manufacturing process innovation

We are making efforts to realize new processing and joining technologies to reduce costs and enhance quality in processes for the manufacturing of electrical components.

[Image] Wafer dicing by metal assisted chemical etching

Wafer dicing by metal assisted chemical etching

[Image] Micro friction stir welding

Micro friction stir welding