Toshiba's New LSIs bring 3D Sound to Wide Range of Electronic Equipment 20 April, 1999
Tokyo--Toshiba Corporation today announced the introduction of 3D sound LSIs, employing the Sound Retrieval System SRS The new LSI integrates 3D stereo and monaural sound capabilities. Through a design based on partial sharing of a signal-processing filter by the LSI's stereo and monaural modes, Toshiba has dramatically reduced the count of external parts, such as resistors and condensers, cutting it to only 40% that of its competitors products. This innovative approach supports development of miniaturized sound cards supporting both stereo and monaural 3D surround sound, bringing improved sound capabilities to a wide range of products, including personal computers and game applications. Engineering samples will be available from May, 1999 at a sample price of 600 yen, in two kinds of packages: TA2136F, a Shrink Small Outline Package (SSOP) with 24 pins; and TA2136N, a Shrink Dual Inline Package (SDIP) with 24 pins. Mass production will start from July 1999, at 20,000 to 30,000pcs units a month. Specifications of LSI
The SRS; Sound Retrieval System and |
![]() |
Information in the press releases, including product prices and specifications, content of services and contact information, is current on the date of the press announcement,but is subject to change without prior notice. |