AI Digital R&D Center

Master in Physics
Mechanical Systems R&D Dept.

Research Area:

• ● Thermal analysis
• ● Machine learning
• ● Structural analysis

Papers/Conference Talks:

• ● Hideaki Uehara, Tomoko Monda, Akira Kano, Tomoya Fumikura, Kenji Hirohata, “Prognostic Health Monitoring Method For Thermal Fatigue Failure Of Power Module Solder Joints Using The Grain Boundary Sliding Model”, 2021 International Conference on Electronics Packaging (ICEP),

Patents (Issued ones only):

• ● P7707124, “Information Processing Apparatus, Information Processing Method, and Program”