[ Semiconductor ]
Assembly process: The packaging and final test process that follows the chip-fabrication process in the overall semiconductor production processes.
Bit: Short for 'Binary Digit, the smallest piece of data that a computer recognizes, represented by "1" and "0" which, in various combinations, represent characters and numbers. 8 bits = 1 Byte.
Byte: 1 Byte = 8 bits.
Discrete: A single-function semiconductor device, such as a transistor or diode, mounted in an individual package.
Fab: Fabrication facility.
GaN: Gallium Nitride.
NAND flash memory: A kind of non-volatile memory device that can retain data when switched off.
Nanometer: nm (1 billionth of a meter).
Power devices: A kind of discrete devices designed to handle high voltages and currents.
Process technology: Technology for the wafer-fabrication process. The technology node is defined by using the wiring pitch of integrated circuits (IC).
SiC: Silicon Carbide.
System LSI: System LSI are large-scale integrated circuits that incorporate special or plural functions.
Wafer fabrication process: The chip-fabrication process in the overall semiconductor production process, prior to the assembly process.
[ Storage ]
Near-line HDD: A kind of enterprise-use HDD that has high capacity and lower rotation speed and power consumption than traditional enterprise HDDs. Used as Tier 2 and/or Tier 3 storage in tiered storage system.
SSD: Solid State Drive.
Traditional enterprise HDD: An enterprise-use HDD historically used for server and storage systems. These HDDs has high rotation speeds such as 10,000-15,000 rpm and transfer data at high rates.
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