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Electronic Devices

[ Semiconductor ]

Assembly process: The packaging and final test process that follows the chip-fabrication process in the overall semiconductor production processes.

Bit: Short for 'Binary Digit, the smallest piece of data that a computer recognizes, represented by "1" and "0" which, in various combinations, represent characters and numbers. 8 bits = 1 Byte.

Byte: 1 Byte = 8 bits.

Discrete: A single-function semiconductor device, such as a transistor or diode, mounted in an individual package.

Fab: Fabrication facility.

GaN: Gallium Nitride.

NAND flash memory: A kind of non-volatile memory device that can retain data when switched off.

Nanometer: nm (1 billionth of a meter).

Power devices: A kind of discrete devices designed to handle high voltages and currents.

Process technology: Technology for the wafer-fabrication process. The technology node is defined by using the wiring pitch of integrated circuits (IC).

SiC: Silicon Carbide.

SoC: System-on-Chip.

System LSI: System LSI are large-scale integrated circuits that incorporate special or plural functions.

Wafer fabrication process: The chip-fabrication process in the overall semiconductor production process, prior to the assembly process.

[ Storage ]

Near-line HDD: A kind of enterprise-use HDD that has high capacity and lower rotation speed and power consumption than traditional enterprise HDDs. Used as Tier 2 and/or Tier 3 storage in tiered storage system.

SSD: Solid State Drive.

Traditional enterprise HDD: An enterprise-use HDD historically used for server and storage systems. These HDDs has high rotation speeds such as 10,000-15,000 rpm and transfer data at high rates.

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