Toshiba Group strives to reduce the emission of chemical substances by designating substances that have large direct impacts on the environment as those targeted for reduction.
In FY2021, Toshiba Group took measures to address solvents used in cleaning and resin processing, which are the major emissions in terms of volume. We promoted initiatives such as using alternative substances and improving productivity and manufacturing processes in order to reduce the use of raw materials as well as reducing the evaporation of volatile organic compounds (VOCs) by enhancing chemical management. As a result, the quantity of chemical substance emissions per unit activity was 87% of the FY2020 level and we therefore achieved our target.
Toshiba Group plans to use alternative substances and increase the efficiency of using materials by improving processes as an incoming countermeasure and to expand the usage of equipment to remove and capture emitted substances as an outgoing countermeasure.
■ Emissions of substances targeted for reduction and the rate of improvement per unit activity
■ Breakdown of emissions of substances targeted for reduction (FY2021)
Case: Reducing the amount of chemical substances used and discharged in semiconductor manufacturing processes (Optimization of resist coating)
Toshiba Electronic Devices & Storage Corporation Group
・Toshiba Electronic Devices & Storage Corporation Himeji Operations-Semiconductor
・Japan Semiconductor Corporation Headquarters/Oita Operations
・Kaga Toshiba Electronics Corporation
Toshiba Electronic Devices & Storage Corporation Group uses various chemical substances in the manufacturing processes of semiconductor and storage products. As well as avoiding the use of hazardous chemicals as much as possible and replacing them with non-hazardous chemicals, the amount of chemicals used is being reduced (optimization of use) by improving the manufacturing process, improving yields and other productivity measures. Toshiba Electronic Devices & Storage Corporation Group also works to minimize the impact of chemical substances used on the global environment by reusing and recycling them and making them harmless through exhaust gas treatment and waste water treatment. By working on reduction and improvement in both the use of chemical substances (input) and their discharge and disposal (output), the group promotes the reduction of environmental risks in business activities while contributing to conserving the global environment.
Toshiba Electronic Devices & Storage Corporation Group is working to reduce the amount of chemical substances used in the resist process as part of the semiconductor manufacturing process (upstream process) and those discharged by examining the optimal conditions for each process and piece of equipment as they are applied to wide variety of products.
Case: Reducing the amount of paints used by using a colored caulking compound
Kitashiba Electric Co., Ltd.
A volatile organic compound (VOC) is a chemical substance contained in abundance in paints, etc. that becomes a cause of air pollution as suspended particulate matter or photochemical oxidant when released into the air. As such, Kitashiba Electric is working to reduce the amount of VOCs used. When assembling a transformer, a caulking compound is used for rust prevention where surfaces meet. Previously, a cissing prevention agent was applied on the caulking compound and then a finishing paints in an exterior painting color was applied on them, because the color of the caulking compound is different from the exterior painting color.
Recently, Kitashiba Electric introduced a colored caulking compound to eliminate the cissing prevention agent and finishing paints. As a result, the amount of paints used in the typical transformer was reduced by approximately 5 kg per. Going forward, Kitashiba Electric will expand the scope of application of the colored caulking compound in an attempt to further reduce the amount of painting materials used.
The area where the colored caulking compound is used
The area where the colored caulking compound is used
Case: Reducing the amount of chemical substances used and their emissions by introducing a multi-spot flow system
P.T. TEC Indonesia
As part of our measures to reduce environmental impacts, we appropriately manage chemical substances and continue to make efforts to reduce their use and emissions in manufacturing processes. In the regular circuit board manufacturing process, isopropyl alcohol (IPA) is used in the pre-treatment for soldering to clean the entire circuit board surface. However, in an attempt to reduce environmental impacts, since some circuit boards can be cleaned with partial coating, we have adopted a soldering system called “multi-spot flow” that reduces the amount of IPA used and its emissions when performing partial coating.
This system has already been installed at our manufacturing sites in China and other countries and we have achieved some results. In FY2019, P.T. TEC Indonesia introduced this system and reduced the amount of IPA used in the circuit board manufacturing process by 25%. Partially implementing this system also reduces the energy used to melt solder, thus contributing to global warming countermeasures.
- Management of Chemical Substances (Toshiba Tec Corporation)