Toshiba Group strives to reduce the emission of chemical substances by designating substances that have large direct impacts on the environment as those targeted for reduction.
In FY2022, Toshiba Group took measures to address solvents used in cleaning and resin processing, which are the major emissions in terms of volume. We promoted initiatives such as using alternative substances and improving productivity and manufacturing processes in order to reduce the use of raw materials as well as reducing the evaporation of volatile organic compounds (VOCs) by enhancing chemical management. As a result, the quantity of chemical substance emissions per unit activity was 91% of the FY2021 level and we therefore achieved our target.
Toshiba Group plans to use alternative substances and increase the efficiency of using materials by improving processes as an incoming countermeasure and to expand the usage of equipment to remove and capture emitted substances as an outgoing countermeasure.
■ Emissions of substances targeted for reduction and the rate of improvement per unit activity*1
■ Breakdown of emissions of substances targeted for reduction (FY2022)
- Basic-unit uses values such as production output, the number of products manufactured, the number of persons and total floor area, etc, that are related to chemical substance emissions associated with manufacturing.
- The rate of improvement per unit activity of output with FY2020 as 100%
Case: Reducing the amount of paints used by using a colored caulking compound
Kitashiba Electric Co., Ltd.
A volatile organic compound (VOC) is a chemical substance contained in abundance in paints, etc. that becomes a cause of air pollution as suspended particulate matter or photochemical oxidant when released into the air. As such, Kitashiba Electric is working to reduce the amount of VOCs used. When assembling a transformer, a caulking compound is used for rust prevention where surfaces meet. Previously, a cissing prevention agent was applied on the caulking compound and then a finishing paints in an exterior painting color was applied on them, because the color of the caulking compound is different from the exterior painting color.
Recently, Kitashiba Electric introduced a colored caulking compound to eliminate the cissing prevention agent and finishing paints. As a result, the amount of paints used in the typical transformer was reduced by approximately 5 kg per. Going forward, Kitashiba Electric will expand the scope of application of the colored caulking compound in an attempt to further reduce the amount of painting materials used.
The area where the colored caulking compound is used
The area where the colored caulking compound is used
Case: Reducing the amount of chemical substances used in semiconductor manufacturing processes
Oita Operations, Japan Semiconductor Corporation
Japan Semiconductor Corporation manufactures a wide range of semiconductor products, including MCU products*1, ASIC products*2, and analog products*3. To maintain the quality of mass-produced items such as semiconductor products, continuous verification of process capabilities for manufacturing processes is indispensable. Thus, Oita Operations worked to optimize the verification frequency of process capabilities by targeting silicon wafer surface film formation equipment while maintaining quality as well as improving productivity. As a result, by reducing the frequency, silane gas used in the capacity evaluation process was reduced by 37.5% per year, resulting in a reduction in the use of chemical substances.
- MCU (Micro Computer Unit) products: Semiconductors that control electronic devices. Example products: electrical and electronic products including TVs, telephones, and refrigerators; industrial equipment; vehicle engine control; and car navigation systems, etc.
- ASIC (Application Specific Integrated Circuit) products: Semiconductors specially designed and manufactured according to a customer's particular use. Example products: Printers, game consoles, and electronic musical instruments, etc.
- Analog products: Semiconductors that process and control analog signals of light, heat (temperature), sound, vibration, etc. captured by sensors by converting them into digital signals, or vice versa. Example products: Electrical and electronic products, car audio systems, and wireless power feeding systems, etc.
- Products and Technology（Japan Semiconductor Corporation）
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Case: Reducing the amount of chemical substances used and their emissions by introducing a multi-spot flow system
P.T. TEC Indonesia
As part of our measures to reduce environmental impacts, we appropriately manage chemical substances and continue to make efforts to reduce their use and emissions in manufacturing processes. In the regular circuit board manufacturing process, isopropyl alcohol (IPA) is used in the pre-treatment for soldering to clean the entire circuit board surface. However, in an attempt to reduce environmental impacts, since some circuit boards can be cleaned with partial coating, we have adopted a soldering system called “multi-spot flow” that reduces the amount of IPA used and its emissions when performing partial coating.
This system has already been installed at our manufacturing sites in China and other countries and we have achieved some results. In FY2019, P.T. TEC Indonesia introduced this system and reduced the amount of IPA used in the circuit board manufacturing process by 25%. Partially implementing this system also reduces the energy used to melt solder, thus contributing to global warming countermeasures.
- Management of Chemical Substances (Toshiba Tec Corporation)
